秒速赛车五码计划两期
Connects outer layer with inner layer; exposed only on one side of the board.
秒速赛车玩法技巧
Connect internal layers without being exposed on either surface.秒速赛车官方
Integrated circuits glued and wire-bonded to boards (foregoing packaging) culminating in a Chip with fine wires bonded to both it and landing pads.秒速赛车网
For purpose of controlling deposition, a mask is applied through use of photographic imaging techniques.秒速赛车人工计划网
Copper layer connected to the ground that covers most of the board layer it inhabits.秒速赛车开奖结果软件
Surface adhesive substance spread for bonding or coating, this material (most commonly FR-4) is non-conductive carrier of copper traces.秒速赛车遗漏
Also known as Final Finish, it is selected by the customer. The Assembly component process determines plating for the top and bottom layers. The different surface finishing processes are ENEPIG, ENIG, HASL, Pb-free HASL, OSP, Immersion gold, Immersion silver, and Deep Gold. Various factors considered during selection process include application and shelf life.秒速赛车官方直播
Copper strip used for carrying signal between two points on a circuit board.